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[News] ASENDIA Embraces KFE Technology... Positions to Lead Next-Gen RF Matcher Market

2026.07.03

ASENDIA, Specialist in Plasma RF Components, Signs 'DiCoVI' Licensing Agreement with KFE
Directional Coupling Technology Overcomes Existing Limitations, Dramatically Improving Power Measurement Accuracy
Company to Integrate Technology into Next-Gen Impedance Matching System, Targeting Global Process Equipment Market

▲ At the technology transfer agreement signing ceremony held on July 1, 2026, in the main conference room of KFE's headquarters building in Daejeon, Asendia CEO Park Moon-soo (left) and a KFE representative pose for a commemorative photo after signing the licensing agreement for 'high-precision RF power measurement technology.

 

Asendia, a specialist company in plasma process components, is accelerating its push into the next-generation semiconductor market by securing core source technology from a government-funded research institute.

The company plans to elevate its global competitiveness by acquiring radio-frequency (RF) power measurement technology essential for ultra-fine process applications.

On July 1, Asendia held a signing ceremony at KFE's headquarters in Daejeon for a technology licensing agreement covering the 'DiCoVI Sensor,' a high-precision RF power measurement technology.

Through this agreement, Asendia's component technology capabilities and KFE's core plasma source technology have been brought together.

 

"The Next-Generation Plasma Diagnostic Technology 'DiCoVI' Unveiled"

 

The DiCoVI sensor technology transferred in this agreement is an innovative technology that precisely measures the actual power delivered into plasma equipment.

It is regarded as a core factor determining the performance of plasma equipment used in semiconductor and display manufacturing.

Conventional VI sensors used in mass production sites relied solely on voltage and current to assess power status, which limited their ability to obtain accurate readings in highly variable plasma environments.

As equipment grew more complex, it became increasingly difficult to accurately capture the actual power being delivered.

The DiCoVI sensor developed by KFE solves this problem through directional coupling technology.

It works by precisely separating and measuring the amount of power flowing from the equipment into the plasma versus the reflected power bouncing back. This approach is recognized for dramatically improving data reliability.

 

"Integration with Flagship Product 'RF Matcher' Accelerates Early Commercialization"

 

Asendia plans to immediately apply the acquired technology to its flagship product, the 'RF Matcher (impedance matching system).'

The strategy is to secure early market leadership by developing next-generation products that provide the high-precision RF power sensing signals required for ultra-fine process applications.

Beyond simply supplying components, the company will also pursue solutions for the early detection of equipment anomalies, along with integration with AI-based process control systems, aiming to maximize added value through technological advancement.

Asendia CEO Park Moon-soo expressed his delight at securing KFE's core source technology, stating that the company would maintain close follow-up joint research and technical consultation to swiftly establish a production system for next-generation products.

 

Source: Energy Safety Newspaper (https://www.esnews.kr)

 

*Original Article: https://zdnet.co.kr/view/?no=20260213105950

 

*Additional Sources:

https://www.hellodd.com/news/articleView.html?idxno=112334

https://www.sisaweek.com/news/articleView.html?idxno=236518

https://www.technoa.co.kr/news/articleView.html?idxno=101122

https://www.etnews.com/20260701000512

https://www.newsis.com/view/NISX20260701_0003692309

https://www.fnnews.com/news/202607010958566236

https://biz.heraldcorp.com/article/10794821?ref=naver

https://www.breaknews.com/1218384